Elpida Memory and subsidiary Akita Elpida Memory said Wednesday that they have developed technology to mass-manufacture a four-layer DRAM package just 0.8 millimeters thick that can be used to pack more memory into thinner mobile phones and tablets.
Japanese DRAM maker Elpida Memory on Monday said its factories are operating "at close to normal levels" two weeks after the 9.0-magnitude earthquake in Japan, and that it has "sufficient parts and materials to continue supplying out customers as usual until the end of July."
The devastating earthquake and tsunami that hit Japan on March 11 took a tragic toll on human life but also rocked markets this week, sending shares of businesses, including technology vendors, on a rollercoaster ride.
Some Japanese chip makers are starting to pick themselves up and resume operations in the earthquake and tsunami-torn northeast.
Prices of widely used chips, including NAND flash memory and DRAM, have both risen sharply since the 9.0-magnitude earthquake struck and hurled tsunami waves at the northeastern part of Japan.